SiP

SiP (System-in-Package) integrates multiple heterogeneous chips into a single package. Applications include Multi-Chip Modules (MCM), Multi-Chip Packages (MCP), chip-to-chip packaging, Package-in-Package (PiP), and substrates with embedded components. SiP offers IC system designers a functional integration alternative to System-on-Chip (SoC), addressing the demand for products that are thinner, lighter, and more compact, while also accommodating rapid product iteration cycles.