Advanced Substrates Technology and One-Stop Solution.
Leading Substrate Technology, Empowering Diverse Applications.
Our Products
Substrates integrate advanced microcircuits and different interconnect options, tailored precisely to varying packaging and application needs.
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SiP
SiP (System-in-Package) integrates multiple heterogeneous chips into a single package. Applications include Multi-Chip Modules (MCM), Multi-Chip Packages (MCP), chip-to-chip packaging, Package-in-Package (PiP), and substrates with embedded components. SiP offers IC system designers a functional integration alternative to System-on-Chip (SoC), addressing the demand for products that are thinner, lighter, and more compact, while also accommodating rapid product iteration cycles.
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PBGA
The PBGA is the most fundamental Ball Grid Array (BGA) substrate used in wire-bond packaging; it is constructed from a copper-clad laminate made of resin-impregnated glass fiber. Plastic BGA substrates are suitable for packaging chips with very high pin counts. As chip functionality advances—typically accompanied by an increase in input/output (I/O) pin counts—traditional lead-frame packaging structures often prove inadequate;
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FCCSP
As the functionality and network connectivity speeds of smartphones have improved, the required pin count for their processors has risen accordingly. With the continuous increase in chip I/O pin counts, Flip-Chip Chip-Scale Packaging (FCCSP) has increasingly demonstrated a cost advantage. Recently, the manufacturing costs for on-chip bumps have also continued to decline, further driving down packaging costs.
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CSP
The trend toward devices that are thinner, lighter, and smaller has driven the miniaturization of components and parts. Consequently, thinner and smaller IC packages have become a fundamental technical requirement for components in handset devices; under these demands, Chip Scale Packaging (CSP) has emerged as the primary packaging technology for internal components in such devices.
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RF Module
Applications such as cloud-based software, video streaming, and AI-generated imagery consume significant bandwidth on consumer electronics. To meet the demands for higher speeds, lower latency, and reduced interference, network technologies are evolving to utilize more frequency bands and adopt advanced communication protocols. This trend manifests in handheld devices, IoT products, and virtual reality equipment through the increased use of power amplifiers and RF front-end modules. The packaging substrates for RF modules differ slightly from standard digital circuit designs; they require greater design expertise and precision, as well as stricter process control to prevent signal interference.
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FCBGA
The adoption of AI has grown exponentially, driving continuous upgrades in the processing power and integration levels of AI-focused processors. Flip-chip Ball Grid Array (FC-BGA) packaging not only enables chips with thousands of pins to achieve superior performance but also offers cost advantages. In the large-scale application environments of AI data centers and cloud infrastructure—where servers and enterprise-grade switches are ubiquitous—there is a constant demand for chips capable of multitasking or high-speed processing. As pin counts continue to rise, FC-BGA packaging has become the mainstream technology for high-end chips such as GPUs and CPUs.
