FCBGA

The adoption of AI has grown exponentially, driving continuous upgrades in the processing power and integration levels of AI-focused processors. Flip-chip Ball Grid Array (FC-BGA) packaging not only enables chips with thousands of pins to achieve superior performance but also offers cost advantages. In the large-scale application environments of AI data centers and cloud infrastructure—where servers and enterprise-grade switches are ubiquitous—there is a constant demand for chips capable of multitasking or high-speed processing. As pin counts continue to rise, FC-BGA packaging has become the mainstream technology for high-end chips such as GPUs and CPUs.