PBGA

The PBGA is the most fundamental Ball Grid Array (BGA) substrate used in wire-bond packaging; it is constructed from a copper-clad laminate made of resin-impregnated glass fiber. Plastic BGA substrates are suitable for packaging chips with very high pin counts. As chip functionality advances—typically accompanied by an increase in input/output (I/O) pin counts—traditional lead-frame packaging structures often prove inadequate;