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In addition to its core strengths in talent and technology, Taiwan’s semiconductor industry relies on a comprehensive and well-integrated supply chain. In recent years, advanced packaging technologies such as BGA, CSP, and Flip-Chip have increasingly become mainstream solutions in IC packaging. Kinsus’ continued investment in the research, development, and manufacturing technologies of IC packaging substrates has established a strong technological advantage. Its capabilities encompass fine-line circuitry, ultra-thin substrates, and complex structures. Combined with keen insight into market developments and customer needs, these strengths have enabled Kinsus to progressively build a comprehensive competitive advantage and maintain its technological leadership within the industry.
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