SiP (System In Package) substrate
Description
A carrier substrate provides a platform for multiple chips or packages or passive components assembly. The applications include Multi-Chip Module (MCM), Multi-Chip Package (MCP), Stack Die, Package in Package (PiP),and Embedded Substrates. SiP provides integration other than System-on-Chip (SoC). SiP integrates inhomogeneous ICs and other components with compact profile and faster time-to-market.
- Modules in handset
- Modules in wearable devices
Applications
- Fine line and fine pitch
- Multiple surface finish
- High layer counts
Features