Product

CSP1
CSP1
CSP2
CSP3

CSP (Wire Bond Chip Scale Package) substrate

Description

Miniaturization is the trend driving features of handheld device, on device itself and components inside. Thinner profile and smaller package foot print is the requirements for these applications. Chip Scale Package provides excellent features meeting both requirements and becomes the main stream technology for packaging chips applying in handheld devices, especially.

    Applications

  • Application processor
  • Connectivity
  • Power management
  • Memory

    Features

  • Strip form
  • Multiple surface finish
  • Thin and flat board
  • Multiple rows of bond pads for stacked chips