FCCSP (Flip Chip Chip Scale Package) substrate
Description
Smart phones become basic personal device people carry every day. High computing capability and powerful connectivity drives I/O count on chips. Flip chip packaging is the most cost effective solution when pin count increased. Bumping cost has been driven down and then FCCSP becomes the main stream technology for low profile yet high pin count chips, like application processors.
- Application processor
- Connectivity
Applications
- Single unit or strip form
- Fine pitch, mSAP process
- Thin and flat board
- Coreless process
Features