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SiP
A carrier substrate provides a platform for multiple chips or packages or passive components assembly. -
PBGA
The typical BGA substrate for wire bonding IC packaging application is based on glass fiber immersed resin copper clad laminate. -
FCCSP
Smart phones become basic personal device people carry every day. High computing capability and powerful connectivity drives I/O count on chips. -
CSP
Miniaturization is the trend driving features of handheld device, on device itself and components inside. -
RF modules
Higher demand on frequency bandwidth, driven by massive apps and multi media through wireless telecommunication, needs more bands in the handset. -
FCBGA
Flip Chip packaging is excellent for very high pin count chips like microprocessors or graphic processors.