FCBGA (Flip Chip Ball Grid Array) substrate
Description
Flip Chip packaging is excellent for very high pin count chips like microprocessors or graphic processors. It is almost not possible, cost and performance wise, to package a thousand I/O count chip with wire bonding technology. Even more powerful computing capability in server and data center will be required in the IoT era. Higher pin count chips will definitely dominate the core of cloud.
- Microprocessors
- Graphic processors
- ASIC
- Field Programmable Gate Array
Applications
- Single unit form
- Fine pitch pattern
- High layer count
- Multiple surface finish
Features