PBGA (Plastic Ball Grid Array) substrate
Description
The typical BGA substrate for wire bonding IC packaging application is based on glass fiber immersed resin copper clad laminate. PBGA packaging is a cost effective solution for wide range of chip I/O count. When IC functionality has been upgraded, it always migrates from lead frame packaging into BGA packaging.
- Microprocessors, controller
- Graphic processors
- ASIC
- PC chipsets
Applications
- Strip form
- Multiple surface finish
- Wide range of material selection
Features