Product

PBGA
PBGA

PBGA (Plastic Ball Grid Array) substrate

Description

The typical BGA substrate for wire bonding IC packaging application is based on glass fiber immersed resin copper clad laminate. PBGA packaging is a cost effective solution for wide range of chip I/O count. When IC functionality has been upgraded, it always migrates from lead frame packaging into BGA packaging.

    Applications

  • Microprocessors, controller
  • Graphic processors
  • ASIC
  • PC chipsets

    Features

  • Strip form
  • Multiple surface finish
  • Wide range of material selection