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| PBGA |
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| The plastic BGA is built in strip form. A high … |
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| CSP |
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| The wire bond version of substrate, in a … |
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| Cavity Down |
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| Cavity-down design with copper alloy heat … |
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| SiP |
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| System-in-Package (SiP) is more than an IC … |
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| Flip Chip |
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| The flip-chip version of PGBA with presolder at … |
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| COB |
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| Chip-on-Board, or COB, refers to the … |
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| COF |
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| Single sided roll-to-toll type COF film is a … |
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